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Manuel Seckel

Observed names: M. Seckel, Seckel, M.
ORCID: 0000-0001-6575-2287
Observed ORCID: 0000-0001-6575-2287
OpenAlex ID: A5036265415
Cyclic endurance reliability of stretchable electronic substrates
2010 · F. Bossuyt, J. Guenther, et al. · Microelectronics Reliability · 76
Multifunctional Metasurface Architecture for Amplitude, Polarization and Wave-Front Control
2022 · A. Pitilakis, M. Seckel, et al. · Physical Review Applied · 55
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Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
2020 · Kypros M. Kossifos, Loukas Petrou, et al. · IEEE Access · 41
Stretchable Circuit Board Technology and Application
2009 · Rene Vieroth, Thomas Loher, et al. · International Symposium on Wearable Computers · 39
Stretchable electronic systems: Realization and applications
2009 · Thomas Loher, Manuel Seckel, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 23
Stretchable electronic systems for wearable and textile applications
2008 · Thomas Loher, Rene Vieroth, et al. · IEEE VLSI Packaging Workshop of Japan (VPWJ) · 18
Highly integrated flexible electronic Circuits and Modules
2008 · Thomas Loher, Manuel Seckel, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 13
Stretchable electronics manufacturing and application
2010 · Thomas Loher, Manuel Seckel, et al. · Electronic System-Integration Technology Conference (ESTC) · 12
Manufacturing Concepts for Stretchable Electronic Systems
2008 · Andreas Ostmann, Thomas Loher, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 10
Conformable Electronics: Integration of electronic functions into static and dynamic free form surfaces
2019 · Thomas Loher, Manuel Seckel, et al. · IEEE CPMT Symposium Japan (ICSJ) · 7
Manufacturing of high frequency substrates as software programmable metasurfaces on PCBs with integrated controller nodes
2020 · D. Manessis, M. Seckel, et al. · Electronic System-Integration Technology Conference (ESTC) · 6
Stretchable circuit board technology in textile applications
2009 · Andreas Ostmann, Rene Vieroth, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 6
Development of innovative substrate and embedding technologies for high frequency applications
2021 · Dionysios Manessis, Stefan Kosmider, et al. · European Microelectronics and Packaging Conference · 5
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High Frequency Substrate Technologies for the Realisation of Software Programmable Metasurfaces on PCB Hardware Platforms with Integrated Controller Nodes
2019 · D. Manessis, M. Seckel, et al. · European Microelectronics and Packaging Conference · 5
UV and IR Laser-Patterning for High-Density Thin-Film Neural Interfaces
2021 · Andrada I. Velea, Joshua Wilson, et al. · European Microelectronics and Packaging Conference · 4
Stretchable and deformable electronic systems in thermoplastic matrix materials
2014 · Thomas Loher, Andreas Ostmann, et al. · IEEE CPMT Symposium Japan (ICSJ) · 3
Concepts for realizing High-Voltage Power Modules by Embedding of SiC Semiconductors
2023 · Lars Böttcher, Andreas Ostmann, et al. · European Microelectronics and Packaging Conference · 2
Modular microelectronics by System-in-Packages with embedded components
2011 · A. Ostmann, B. Bruehl, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2
Determination of relevant material behavior for use in stretchable electronics
2018 · H. Walter, A. Grams, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Large area processes for 3D shaped electronics
2016 · Andreas Ostmann, Thomas Loeher, et al. · Electronic System-Integration Technology Conference (ESTC) · 1
Robust Module Integration of Back Contact Cells by Interconnection Adapters
2014 · Ebert, M., Seckel, M., et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 1
Advanced Embedding Technologies for High Performance SiC Power Modules in Automotive Applications
2026 · Lars Böttcher, David Schütze, et al. · IMAPSource Proceedings
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Thermoplastic polyurethane as a base material for soft, high-density neural interfaces
2026 · Anna Pak, Andrada Iulia Velea, et al. · bioRxiv (Cold Spring Harbor Laboratory)
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Novel Integration Concepts for Power Electronics – Embedding of SiC MOSFET for High-Performance Power Modules
2025 · Lars Böttcher, Thomas Löher, et al. · SMTA International
Concepts for realizing High-Voltage Power Modules by Embedding of SiC Semiconductors
2024 · Lars Böttcher, Andreas Ostmann, et al. · IMAPSource Proceedings
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Works count: 29
Citation count: 330
H-index: 9
I10-index: 9
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