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Christian Göth

Observed names: C. Goth, Christian Goth, Dr. Christian Goth, Goth, Christian
ORCID: 0009-0001-4634-5982
Observed ORCID: 0009-0001-4634-5982
OpenAlex ID: A5050474616
Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applications
2011 · Christian Goth, Sonja Putzo, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 131
Electrical functionalization of thermoplastic materials by Aerosol Jet Printing
2011 · J. Hoerber, C. Goth, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 30
3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier
2011 · Michael Pfeffer, Christian Goth, et al. · IEEE International Symposium on Assembly and Manufacturing · 15
Hot Pin Pull Method – New Test Procedure for the Adhesion Measurement for 3D-MID
2014 · Christian Goth, Thomas Kuhn, et al. · Advanced materials research · 12
Reliability of molded interconnect devices (MID) protected by encapsulation methods overmolding, potting and coating
2012 · Christian Goth, Jorg Franke, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 9
Aerosol-Jet Printing for Functionalization of Prototyping Materials for Electronic Applications
2012 · Johannes Hörber, Christian Goth, et al. · IMAPSource Proceedings · 7
Reliability of lead-free solders for die attach in automotive power modules
2022 · Bettina Ottinger, Joshua Holverscheid, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5
Reliability of micromechatronic systems with chip on molded interconnected devices and flexible substrates
2010 · A. Reinhardt, J. Franke, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5
Analyse und Optimierung der Entwicklung und Zuverlässigkeit räumlicher Schaltungsträger (3D-MID)
2013 · Goth, Christian · 3
Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation
2023 · B. Ottinger, A. Mathew, et al. · Microelectronics Reliability · 2
Experimental characterization and finite element analysis of thermo-mechanical stress in flip-chip- and wirebond-assemblies on flexible and injection molded thermoplastic substrates
2012 · C. Goth, A. Reinhardt, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
Effiziente rechnergestützte Produktentwicklung für räumliche elektronische Baugruppen
2009 · Jörg Franke, Christian Goth, et al. · Zeitschrift für wirtschaftlichen Fabrikbetrieb · 2
MID Technology and Mechatronic Integration Potential
2014 · C. Goth, T. Kuhn · Carl Hanser Verlag GmbH & Co. KG eBooks · 1
Interconnection Technology
2014 · C. Goth · Carl Hanser Verlag GmbH & Co. KG eBooks · 1
Interdisziplinäre Zusammenarbeit zur spezifischen Förderung der MID-Technologie
2007 · Klaus Feldmann, Christian Goth, et al. · Zeitschrift für wirtschaftlichen Fabrikbetrieb · 1
Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules
2025 · M. Sprenger, M. Fegus, et al. · International Spring Seminar on Electronics Technology
Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as a die-attach method for automotive power modules
2023 · Bettina Ottinger, Joshua Holverscheid, et al. · IMAPSource Proceedings
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Molded Interconnect Devices – Progressive Approach for Mechatronic Products and Efficient Manufacturing Processes
2010 · Christian Goth, Jörg Franke, et al. · Pan Pacific Symposium
Works count: 18
Citation count: 226
H-index: 6
I10-index: 4
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