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S. W. Ricky Lee

Observed names: LEE, Ricky Shi-wei, Lee S. W. Ricky, Lee S.W. Ricky, Lee, Ricky, Lee, Ricky S W, Lee, Ricky Shi-wei, Lee, S. W.Ricky, Lee, Shi Wei Ricky, Lee, Shi-Wei, Lee, Shi-Wei Ricky, Lee, Shi-wei, P.S.W. Lee, R. Lee, R. S. W. Lee, R.S.W. Lee, RICKY LEE, Ricky Lee, Ricky S W Lee, Ricky S. W. Lee, Ricky S.W. Lee, Ricky Shi Wei Lee, Ricky Shi-Wei Lee, Ricky Shi-wei Lee, Ricky s.w. Lee, S W Ricky Lee, S-W Ricky Lee, S-W. R. Lee, S-W. Ricky Lee, S-W.R. Lee, S. Ricky Lee, S. W. Lee, S. W. R. Lee, S. W. Ricky LEE, S. W. Ricky lee, S.-W. R. Lee, S.-W. RICKY LEE, S.-W. Ricky Lee, S.-W.R Lee, S.-W.R. Lee, S.W. Lee, S.W. Ricky Lee, S.W.R. Lee, S.W.R. Leea, S.‐W. Lee, S.‐W. Ricky Lee, S.‐W.R. Lee, SHI-WEI RICKY LEE, Shi Wei Ricky Lee, Shi-Wei Lee, Shi-Wei R. Lee, Shi-Wei Ricky Lee, Shi-wei Ricky Lee, ShiWei R. Lee, Shi‐Wei Ricky Lee, 卢智铨, Chi Chuen, 李世伟, 李世玮, 李世玮, Shi-wei, 李世瑋, 汪刚强
Observed institutions: Intel (United States), Agilent Technologies (United States), Chinese University of Hong Kong, Hong Kong University of Science and Technology, Purdue University West Lafayette, HKUST Shenzhen Research Institute, Instituto Costarricense de Electricidad, The Hong Kong University of Science and Technology (Guangzhou), University of Maryland, College Park, Virginia Tech, University of Hong Kong, Stanford University
ORCID: 0000-0002-7706-522X
Observed ORCID: 0000-0002-7706-522X
OpenAlex ID: A5061913080
Experimental investigations and model study of moisture behaviors in polymeric materials
2009 · X.J. Fan, S.W.R. Lee, et al. · Microelectronics Reliability · 179
Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
2002 · John H. Lau, C.P. Wong, et al. · 166
Dynamic penetration of graphite/epoxy laminates impacted by a blunt-ended projectile
1993 · S.-W.R. Lee, C.T. Sun · Composites Science and Technology · 123
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 100
Fan-Out Wafer-Level Packaging for Heterogeneous Integration
2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 94
High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
2007 · Fubin Song, S. W. Ricky Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 75
Characterization and analysis on the solder ball shear testing conditions
2002 · Xingjia Huang, S.-W.R. Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 74
Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests
2007 · Fubin Song, S. W. Ricky Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 73
Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
2000 · J.H. Lau, S.-W.R. Lee, et al. · IEEE Transactions on Components and Packaging Technologies · 68
3D LED and IC wafer level packaging
2010 · John Lau, Ricky Lee, et al. · Microelectronics International · 67
Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board
2002 · J.H. Lau, S.-W.R. Lee · IEEE Transactions on Electronics Packaging Manufacturing · 66
A Quasi-Static Penetration Model for Composite Laminates
1993 · S-W. R. Lee, C.T. Sun · Journal of Composite Materials · 62
Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
2009 · P. Chauhan, M. Pecht, et al. · IEEE Transactions on Components and Packaging Technologies · 58
Investigation of IMC Thickness Effect on the Lead-free Solder Ball Attachment Strength: Comparison between Ball Shear Test and Cold Bump Pull Test Results
2006 · F. Song, S.W.R. Lee · IEEE Electronic Components and Technology Conference (ECTC) · 57
Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)
2002 · J.H. Lau, S.-W.R. Lee · IEEE Transactions on Components and Packaging Technologies · 57
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
2018 · Cheng-Ta Ko, Henry Yang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 55
Damage in composite laminates: Effects of transverse cracks
1988 · C.T. Herakovich, J. Aboudi, et al. · Mechanics of Materials · 54
Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination
2006 · K. Lee, S.W. Lee · IEEE Electronics Packaging Technology Conference (EPTC) · 52
Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis
2000 · John H. Lau, S.-W. Ricky Lee, et al. · Journal of Electronic Packaging · 51
Electro-elastic analysis of piezoelectric laminated plates
2007 · Minghao Zhao, Caifu Qian, et al. · Advanced Composite Materials · 49
Drop/impact tests and analysis of typical portable electronic devices
2007 · C.Y. Zhou, T.X. Yu, et al. · International Journal of Mechanical Sciences · 46
Correlation Between Measurement and Simulation of Thermal Warpage in PBGA With Consideration of Molding Compound Residual Strain
2008 · Ming-Yi Tsai, Y.-C. Chen, et al. · IEEE Transactions on Components and Packaging Technologies · 45
Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes
2013 · Huaiyu Ye, Sau Wee Koh, et al. · Applied Thermal Engineering · 44
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
2017 · John Lau, Ming Li, et al. · Journal of Microelectronics and Electronic Packaging · 42
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints
2013 · Chaoran Yang, Fubin Song, et al. · Microelectronics Reliability · 41
Works count: 489
Citation count: 4,547
H-index: 34
I10-index: 119
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