Author

Kuldip Johal

Observed name: K. Johal

Observed institutions: Atotech (Germany), Atotech (United States)

OpenAlex ID: A5067124393

Electroless Nickel / Electroless Palladium / Immersion Gold Plating Process for Gold- and Aluminum-Wire Bonding Designed for High-Temperature Applications

2000 · Ag Paste, Kuldip Johal, et al. · 7

Lead-Free Board Surface Finishes

2007 · Hugh Roberts, Kuldip Johal · Springer eBooks · 6

Electroless Nickel / Immersion Gold Process Technology for Improved Ductility of Flex and Rigid-Flex Applications

2005 · Kuldip Johal, Hugh Roberts, et al. · Pan Pacific Symposium · 4

Autocatalytic tin - how to overcome process limitations to introduce a new solution for thick tin plating

2020 · K. Johal, B. Schafsteller, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3

Multi-layer Copper-Dielectric Adhesion Challenges of 5-12 micron Lines/Spaces for Next Generation SOP (System-on-Package) / Microprocessor Package Substrates

2007 · Boyd Wiedenman, Venky Sundaram, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2

ENEPIG Reliability - Enhancement by Simple Drop in Process Changes

2019 · Kuldip Johal, Rick Nichols · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1

Can peel strength predict the structural integrity of the adhesive bond between the copper and laminate in a PCB

2004 · Patrick Brooks, Kuldip Johal, et al. · 1

Novel Immersion-Sn Passivation Process to Address Nanoporous-Cu Seed Layer Etching Challenge for Scalable, Low-Temperature Panel-Level Cu-Cu Bonding

2026 · Ramón A. Sosa, Vanessa Smet, et al. · IEEE Electronic Components and Technology Conference (ECTC)

Properties of High P ENIG process on Flexible boards

2008 · Kuldip Johal, Hugh Roberts, et al.

Evaluation of Pb-Free BGA Solder Joint Reliability on Ni-Based Surface Finishes using Alternative Shear and Pull Metrologies

2007 · Kuldip Johal, Hugh Roberts, et al. · Pan Pacific Symposium

Evaluation of Surface Finishes for PB-Free Assembly Based on Examination of Solder Wetting Characteristics and Performance

2006 · Sven Lamprecht, Kuldip Johal · SMTA International

Performance and Reliability Evaluation of Alternative Surface Finishes for Wire Bond and Flip Chip BGA Applications

2006 · Kuldip Johal, Hugh Roberts, et al. · Pan Pacific Symposium

Electroless Nickel / Electroless Palladium / Immersion Gold Process for Multi-Purpose Assembly Technology

2004 · Kuldip Johal, Hugh Roberts, et al. · SMTA International

Impacts of Bulk Phosphorous Content of Electroless Nickel Layers to Solder Joint Integrity and Their Use as Gold- and Aluminum-Wire Bond Surfaces

2004 · Kuldip Johal, Hugh Roberts, et al. · Journal of Surface Mount Technology

Electroless Nickel / Electroless Palladium / Immersion Gold Plating Process for Gold- and Aluminum-Wire Bonding Designed for High-Temp Apps

2004 · Kuldip Johal, Sven Lamprecht, et al. · Pan Pacific Symposium

Impacts of Bulk Phosphorous Content of Electroless Nickel Layers to Solder Joint Integrity and Their Use as Gold- and Aluminum-Wire Bond Surfaces

2004 · Kuldip Johal, Sven Lamprecht, et al. · Pan Pacific Symposium

Are You in Control of your Electroless Nickel/Immersion Gold Process?

2001 · Kuldip Johal · SMTA International

Works count: 17

Citation count: 24

H-index: 3

I10-index: