Author

David R. Hetzer

Observed names: D. Hetzer, David Hetzer

Observed institutions: Tokyo Electron (Japan), Rochester Institute of Technology, Center for Nanoscale Science and Technology

OpenAlex ID: A5072962524

Fabrication of 28nm pitch Si fins with DSA lithography

2013 · Gerard Schmid, Richard Farrell, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 26

Towards electrical testable SOI devices using Directed Self-Assembly for fin formation

2014 · Chi-Chun Liu, Cristina Estrada-Raygoza, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 23

Hot melt ink technology for crystalline silicon solar cells

2003 · T. Williams, K. McVicker, et al. · Conference record of the IEEE Photovoltaic Specialists Conference · 15

DSA patterning options for FinFET formation at 7nm node

2016 · Chi-Chun C. Liu, Elliott Franke, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 14

Manufacturability considerations for DSA

2014 · Richard A. Farrell, Erik R. Hosler, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 14

DSA via hole shrink for advanced node applications

2016 · Cheng Chi, Chi-Chun Liu, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11

Fin formation using graphoepitaxy DSA for FinFET device fabrication

2015 · Chi-Chun Liu, Fee Li Lie, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11

Directed self-assembly process implementation in a 300mm pilot line environment

2013 · Chi-Chun Liu, I. Cristina Estrada-Raygoza, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11

EPE improvement thru self-alignment via multi-color material integration

2017 · Nihar Mohanty, Jeffrey T. Smith, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 10

SEMATECH's cycles of learning test for EUV photoresist and its applications for process improvement

2014 · Jun Sung Chun, Shih-Hui Jen, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9

Evaluation of double-patterning techniques for advanced logic nodes

2010 · Chiew-Seng Koay, Steven Holmes, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9

Coater/developer process integration of metal-oxide based photoresist

2015 · Benjamin L. Clark, Michael Kocsis, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8

DSA patterning options for logics and memory applications

2017 · Chi-Chun Liu, Elliott Franke, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7

SADP for BEOL using chemical slimming with resist mandrel for beyond 22nm nodes

2012 · Linus Jang, Sudhar Raghunathan, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7

Ethylene/α-Olefin Copolymerization with Dimethylsilyl-bis(2-methyl-4-phenyl-indenyl) zirconium dichloride and Methylaluminoxane: Influences on Polymerization Activity and Molecular Weight

1999 · Massoud Miri, David Hetzer, et al. · Springer eBooks · 7

Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle

2017 · Cheng Chi, Chi-Chun Liu, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Towards production ready processing with a state-of-the-art EUV cluster

2015 · Karen Petrillo, Nicole Saulnier, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Optimization of pitch-split double patterning phoresist for applications at the 16nm node

2011 · Steven J. Holmes, Cherry Tang, et al. · ASMC proceedings · 6

Towards manufacturing of advanced logic devices by double-patterning

2011 · Chiew-seng Koay, Scott Halle, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Coater/developer-based techniques to achieve tight pitches towards high-NA EUV

2023 · Kanzo Kato, Lior Huli, et al. · Advances in Patterning Materials and Processes · 5

Evaluation of novel processing approaches to improve extreme ultraviolet (EUV) photoresist pattern quality

2015 · Cecilia Montgomery, Jun Sung Chun, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5

The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD

2018 · Chi-Chun Liu, Yann Mignot, et al. · SPIE Novel Patterning Technologies · 4

Coater/developer based techniques to improve high-resolution EUV patterning defectivity

2017 · Eric Liu, Akiteru Ko, et al. · International Conference on Extreme Ultraviolet Lithography · 4

Feasibility study of resist slimming for SIT

2013 · Nicole Saulnier, Chiew-seng Koay, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Multi-color fly-cut-SAQP for reduced process variation

2018 · Richard A. Farrell, Elliott Franke, et al. · Advances in Patterning Materials and Processes · 2

Works count: 33

Citation count: 232

H-index: 9

I10-index: 9