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Author

Mekala Girish Kumar

Observed names: Girish Kumar Mekala, M. Kumar
Institution: VIT-AP University
ORCID: 0000-0003-1724-7336
Observed ORCID: 0000-0003-1724-7336
OpenAlex ID: A5079331263
A Novel Unified Model for Copper and MLGNR Interconnects Using Voltage- and Current-Mode Signaling Schemes
2016 · Yash Agrawal, Mekala Girish Kumar, et al. · IEEE Transactions on Electromagnetic Compatibility · 57
Comprehensive Model for High-Speed Current-Mode Signaling in Next Generation MWCNT Bundle Interconnect Using FDTD Technique
2016 · Yash Agrawal, Mekala Girish Kumar, et al. · IEEE Transactions on Nanotechnology · 47
An Efficient Crosstalk Model For Coupled Multiwalled Carbon Nanotube Interconnects
2017 · Mekala Girish Kumar, Rajeevan Chandel, et al. · IEEE Transactions on Electromagnetic Compatibility · 34
Carbon Nanotube Interconnects − A Promising Solution for VLSI Circuits
2016 · Mekala Girish Kumar, Yash Agrawal, et al. · IETE Journal of Education · 34
Structure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm Optimization
2021 · Takshashila Pathade, Yash Agrawal, et al. · IEEE Transactions on Nanotechnology · 31
A Unified Delay, Power and Crosstalk Model for Current Mode Signaling Multiwall Carbon Nanotube Interconnects
2017 · Yash Agrawal, Mekala Girish Kumar, et al. · Circuits Systems and Signal Processing · 12
A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects
2021 · Mekala Girish Kumar, Yash Agrawal, et al. · Microelectronics Journal · 11
Krill Herd Algorithm for Solution of Economic Dispatch with Valve-Point Loading Effect
2019 · Harish Pulluri, N. Goutham Kumar, et al. · Lecture notes in electrical engineering · 7
Timing and Stability Analysis of Carbon Nanotube Interconnects
2015 · Mekala Girish Kumar, Rajeevan Chandel, et al. · IEEE International Symposium on Nanoelectronic and Information Systems (iNIS) · 7
Reliability Assessment Using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System
2025 · Gulafsha Bhatti, Yash Agrawal, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 6
Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit
2023 · Gulafsha Bhatti, Takshashila Pathade, et al. · IETE Journal of Research · 5
Impact of Temperature on Structure Deformation for Monolithic Inter-Tier vias In Monolithic 3D IC Packaging System
2021 · Gurijala Deepthi, Mekala Girish Kumar, et al. · ECS Journal of Solid State Science and Technology · 5
Performance Analysis of Multilayer Graphene Nano-Ribbon in Current-Mode Signaling Interconnect System
2015 · Yash Agrawal, Rajeevan Chandel, et al. · IEEE International Symposium on Nanoelectronic and Information Systems (iNIS) · 4
Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs
2025 · Mekala Girish Kumar, Yash Agrawal, et al. · IEEE Access · 3
Variability Analysis of On-chip Graphene Interconnects at Subthreshold Regime
2020 · Nikita Patel, Yash Agrawal, et al. · IEEE International Students' Conference on Electrical, Electronics and Computer Science (SCEECS) · 3
Transient and Crosstalk Analysis of Doped and Dielectric Inserted MLGNR Interconnects
2018 · Haritha Yeleti, Mekala Girish Kumar, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) · 3
Mechanical and electrical testing of encapsulated stretchable substrate interconnect models for emerging flexible electronic systems
2025 · Gulafsha Bhatti, Yash Agrawal, et al. · Microelectronics Reliability · 2
Process variations in dielectric inserted side contact multilayer graphene nanoribbon interconnects using montecarlo simulations
2022 · Mekala Girish Kumar, Yash Agrawal, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2
CNTFET Based Low Power Repeaters for On-Chip Interconnect System
2021 · Takshashila Pathade, Yash Agrawal, et al. · International Symposium on VLSI Design and Test (VDAT) · 2
Emerging Graphene FETs for Next-Generation Integrated Circuit Design
2020 · Yash Agrawal, Eti Maheshwari, et al. · Engergy systems in electrical engineering · 2
Performance Analysis of Mixed-Wall CNT Interconnects Using Colliding Bodies Optimization Technique
2019 · Girish Kumar Mekala, Yash Agrawal, et al. · Advances in computer and electrical engineering book series · 2
Stability Analysis of Carbon Nanotube Interconnects
2016 · Mekala Girish Kumar, Yash Agrawal, et al. · Advances in intelligent systems and computing · 2
Assembly Technology Development for 3D Silicon Stacked Module for Handheld Products
2006 · V.P. Ganesh, S. Lim, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Signal Integrity Assessment of GNRFET-Based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion
2023 · Mekala Girish Kumar, Malothu Rajeswari, et al. · ECS Journal of Solid State Science and Technology · 1
Effective Low Power ALU Design with Incorporation of MWCNTB On-chip Interconnects
2022 · Takshashila Pathade, Yash Agrawal, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
Works count: 36
Citation count: 287
H-index: 7
I10-index: 7
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