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Author

Wolfgang Schmitt

Observed name: Wolfgang schmitt
Institution: Heraeus (Germany)
OpenAlex ID: A5091810029
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
2021 · Chin-Hao Tsai, Wei-Chen Huang, et al. · Journal of Materials Research and Technology · 39
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Silver Sinter Paste for SiC Bonding with Improved Mechanical Properties
2017 · Wolfgang Schmitt, Ly May Chew · IEEE Electronic Components and Technology Conference (ECTC) · 38
A breakthrough in power electronics reliability — New die attach and wire bonding materials
2013 · Thomas Krebs, Susanne Duch, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 28
Micro-Silver Sinter Paste Developed for Pressure Sintering on Bare Cu Surfaces under Air or Inert Atmosphere
2018 · Ly May Chew, Wolfgang Schmitt, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 27
Novel silver contact paste lead free solution for die attach
2010 · Wolfgang Schmitt · International Conference on Integrated Power Electronics Systems (CIPS) · 18
New silver contact pastes from high pressure sintering to low pressure sintering
2010 · Wolfgang Schmitt, W.C. Heraeus · Electronic System-Integration Technology Conference (ESTC) · 16
High bonding strength of silver sintered joints on non-precious metal surfaces by pressure sintering under air atmosphere using micro-silver sinter paste
2018 · Ly May Chew, Wolfgang Schmitt, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 10
Pressure-Less Sintering on Large Dies Using Infrared Radiation and Optimized Silver Sinter Paste
2018 · Wolfgang Schmitt, Ly May Chew, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
Sintered Ag joints on copper lead frame TO220 by pressure sintering process with improved reliability and bonding strength
2017 · Ly May Chew, Wolfgang Schmitt, et al. · European Microelectronics and Packaging Conference · 8
Novel interconnect materials for high reliability power converters with operation temperatures above 150°C
2012 · Susanne Duch, Thomas Krebs, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs
2020 · Chin-Hao Tsai, Wei-Chen Huang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Die Attachment on Bare Copper Surface by Non-Pressure Silver Sintering in Inert Atmosphere
2019 · Ly May Chew, Tamira Stegmann, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5
Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance
2023 · Tamira Stegmann, André Schwöbel, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
A New Development of Direct Bonding to Aluminum and Nickel Surfaces by Silver Sintering in air Atmosphere
2019 · Ly May Chew, Tamira Stegmann, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Silver sinter paste for SiC bonding with improved mechanical properties
2019 · Wolfgang schmitt, Ly May Chew, et al. · IEEE International Workshop on Integrated Power Packaging (IWIPP) · 4
High reliable silver sintered joint on copper lead frame by pressure sintering process
2019 · Ly May Chew, Wolfgang Schmitt · IEEE International Workshop on Integrated Power Packaging (IWIPP) · 4
Comparison of Thermal Measurement Methods of Die Attach Materials Used in Power Electronic Modules
2016 · Wolfgang Schmitt, Susanne Duch, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Adjust the mechanical properties of sintered silver layers using additives
2016 · Wolfgang Schmitt, Thomas Krebs · 4
High reliable and high bonding strength of silver sintered joints on copper surfaces by pressure sintering under air atmosphere
2018 · Ly May Chew, Wolfgang Schmitt · IMAPSource Proceedings · 3
Pressureless low temperature sintering paste for NiAu PCB substrate
2016 · Yong Ling Xin, Tan Juo Yan, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3
Failure of Arcing Contacts in Low Voltage Switching Devices --Examples, Root Causes, Counter Measures
2010 · Volker Behrens, Thomas Honig, et al. · IEEE Holm Conference on Electrical Contacts (HOLM) · 3
Improving the bond strength of sinter joints by modifying the DBC without noble finishes and modified silver sinter pastes
2014 · Alexander Roth, Wolfgang Schmitt · 2
Resin / Rosin Free Solder Pastes and Fluxes
2006 · Wolfgang Schmitt · Electronic System-Integration Technology Conference (ESTC) · 2
Direct bonding to aluminum and nickel surfaces by pressure silver sintering
2019 · Ly May Chew, Tamira Stegmann, et al. · International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe)
New Interconnection for High Temperature Application: HotPowCon (HPC)
2018 · Steffen Käss, Sebastian Fritzsche, et al. · SMTA International
Works count: 29
Citation count: 251
H-index: 8
I10-index: 8
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