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Yaxiong Chen

Study on high-speed rail defect detection methods based on ECT, MFL testing and ACFM
2022 · Peng Xu, Yaxiong Chen, et al. · Measurement · 46
Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration
2024 · Souvik Chakraborty, Yaxiong Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
Singular enrichment for multi-material corners with application to assessing the risk of fracture in semiconductor devices
2021 · Chun-Pei Chen, Yaxiong Chen, et al. · Engineering Fracture Mechanics · 9
Damage Evolution in SAC Solder Alloys
2022 · Yaxiong Chen, Torsten Hauck, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7
A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading
2023 · Golam Rakib Mazumder, Mohammad Ashraful Haq, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages
2022 · Chun-Pei Chen, Yaxiong Chen, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
A Mechanistic Model for Plastic Metal Line Ratcheting Induced BEOL Cracks in Molded Packages
2020 · Chun-Pei Chen, Yaxiong Chen, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 5
Effect of Elastic-Plastic Anisotropy of Solder Grains on Variability of Cyclic Mechanical Bending Durability in SAC305 CSP Assembly
2023 · Aniket Bharamgonda, Abhijit Dasgupta, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Parametric stitching for smooth coupling of subdomains with non-matching discretizations
2020 · Chun-Pei Chen, Yaxiong Chen, et al. · Computer Methods in Applied Mechanics and Engineering · 3
Modelling recrystallizaton in oligocrystalline SnAgCu solder joint under cyclic loading condition
2024 · Yaxiong Chen, Torsten Hauck, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2
A Computational Strategy for Code- and Mesh-Agnostic Nonlinear Global–Local Analysis
2022 · Yaxiong Chen, Sai Sanjit Ganti, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2
A New ACFM Probe for Inspection of Rail Crack at High Speed
2021 · Yaxiong Chen, Peng Xu · Global Reliability and Prognostics and Health Management Conference (PHM) · 2
Non-Intrusive Two-Way Coupling for Multiscale Analysis of Electronic Packages
2022 · Sai Sanjit Ganti, Yaxiong Chen, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1
Application model of surface removal contour to blade abrasive belt grinding
2015 · Yun Huang, Yajie Wang, et al. · International Journal of Abrasive Technology · 1
Effect of Primary Creep on Fatigue Behavior of SnAgCu (SAC) Solder Joint Under Different Cyclic Loading Conditions
2025 · Aniket Bharamgonda, Pranav Srinivasan, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Microstructurally Induced Evolution of Creep Strain in SnAgCu (SAC) Solder Joints During Thermal Cycling
2025 · Aniket Bharamgonda, Abhijit Dasgupta, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Electrolytic Deflash & High-pressure Water Jet Simulation Driven Delamination Risk Assessment in Plastic Packages
2025 · Sharan Kishore, Yaxiong Chen, et al. · IMAPSource Proceedings
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Modelling Effect of Isothermal Aging of Anisotropic SaAgCu(SAC) Solder Joint Using Crystal Viscoplasticity
2024 · Aniket Bharamgonda, Abhijit Dasgupta, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Multi-material Corner Singularity in Electronic Packaging: Avoiding Mesh Dependence in Analyzing Stress
2024 · Yaxiong Chen, Torsten Hauck, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Effect of Isothermal Aging on Anisotropic Creep Properties of SAC305 Single Crystals
2024 · Aniket Bharamgonda, Johnathan Martin, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints
2024 · Aniket Bharamgonda, Idowu Olatunji, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Modeling the Microstructure of Polycrystalline Sn–Ag–Cu Solders
2024 · Torsten Hauck, Yaxiong Chen, et al. · Advanced structured materials
Study On Ect Signal Distortion of High-Speed Detection
2024 · Peng Xu, Lili Liu, et al. · SSRN Electronic Journal
Mechanism Design and Dynamical Modelling of a Flexible-Wire-Walking Robot with Swinging-Arms and Rotational Pole
2017 · Yonghua Huang, Yaxiong Chen, et al. · International Conference on Applied Mathematics, Modeling and Simulation (AMMS)
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Works count: 24
Citation count: 102
H-index: 5
I10-index: 2
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