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Jürgen Burggraf
Observed name:
Jurgen Burggraf
Institution:
EV Group (Austria)
Observed institutions:
EV Group (Austria),
Brewer Science (United States)
OpenAlex ID:
A5110200941
CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration
2012
·
Viorel Dragoi
, Eric Pabo
, et al.
·
Microsystem Technologies
·
35
0.5 ¼m Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory
2023
·
Kai Ma
, Nikolaos Bekiaris
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
32
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
2021
·
Serena Iacovo
, Lan Peng
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
29
Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications
2010
·
Viorel Dragoi
, Gerald Mittendorfer
, et al.
·
ECS Transactions
·
28
PDF
Heterogeneous Integration by Collective Die-To-Wafer Bonding
2018
·
Thomas Uhrmann
, Jurgen Burggraf
, et al.
·
International Wafer Level Packaging Conference (IWLPC)
·
26
Recent progress in thin wafer processing
2013
·
Thomas Uhrmann
, Thorsten Matthias
, et al.
·
IEEE International D Systems Integration Conference
·
19
Low temperature Direct Bonding of SiN and SiO interfaces for packaging applications
2020
·
Xavier F. Brun
, Jurgen Burggraf
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
18
Edge Protection of Temporarily Bonded Wafers during Backgrinding
2009
·
Dongshun Bai
, Xing-Fu Zhong
, et al.
·
ECS Transactions
·
17
PDF
Direct Die to Wafer Cu Hybrid Bonding for Volume Production
2023
·
Chun Ho Fan
, Hoi Ping Ng
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
12
Adhesive Wafer Bonding Using Ultra-Thin Spray-Coated BCB Layers
2020
·
Johanna Rimböck
, Jacek Gasiorowski
, et al.
·
ECS Transactions
·
9
Wafer edge defect study of temporary bonded and thin wafers in TSV process flow
2015
·
Jie Gong
, Sumant Sood
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Thin wafer handling and processing-results achieved and upcoming tasks in the field of 3D and TSV
2009
·
Paul Kettner
, Jurgen Burggraf
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
8
Collective Die Bonding: An Enabling Toolkit for Heterogeneous Integration
2020
·
Jürgen Burggraf
, Thomas Uhrmann
, et al.
·
ECS Transactions
·
5
PDF
Thin wafer processing - yield enhancement through integrated metrology
2011
·
Thorsten Matthias
, Daniel Burgstaller
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
Laser Debonding of Ultrathin Wafers and Packages: A Technology for the New Generation of Electronic Devices
2020
·
Julian Bravin
, Jurgen Burggraf
, et al.
·
ECS Meeting Abstracts
·
4
Monolithic Thin Wafer Stacking Using Low Temperture Direct Bonding
2014
·
Jürgen Burggraf
, Julian Bravin
, et al.
·
ECS Transactions
·
4
Temporary bonding on the move towards high volume: A status update on cost-of-ownership
2014
·
Thomas Uhrmann
, Jurgen Burggraf
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Delamination Root Cause in Temporary Bonding
2014
·
Karine Vial
, Frank Fournel
, et al.
·
ECS Transactions
·
2
Effect of Process Variables on Glass Frit Wafer Bonding in MEMS Wafer Level Packaging
2008
·
Sid Sridharan
, Jim Henry
, et al.
·
MRS Proceedings
·
2
Collective Die Bonding: An Enabling Toolkit for Heterogeneous Integration
2020
·
Jurgen Burggraf
, Thomas Uhrmann
, et al.
·
ECS Meeting Abstracts
·
1
Adhesive Wafer Bonding Using Ultra-Thin Spray-Coated BCB Layers
2020
·
Johanna Rimböck
, Jacek Gasiorowski
, et al.
·
ECS Meeting Abstracts
·
1
Monolithic Thin Wafer Stacking Using Low Temperture Direct Bonding
2014
·
Jürgen Burggraf
, Julian Bravin
, et al.
·
ECS Meeting Abstracts
·
1
Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield
2014
·
Thomas Uhrmann
, Jürgen Burggraf
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
·
1
An innovative and low cost Bi-layer method for temporary bonding
2013
·
Jurgen Burggraf
, Harald Wiesbauer
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Temporary-bonding and LowTemp® debonding technology for various applications
2012
·
Masaya Kawano
, Takumi Komatsu
, et al.
·
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
·
1
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Works count:
46
Citation count:
272
H-index:
9
I10-index:
9
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