Get started
Author

J.D. Wu

Observed names: J. D. Wu, J.D Wu, Jenq-Dah Wu, Jun-Yu Wu
Institution: Tsinghua University
ORCID: 0009-0004-6935-8147
Observed ORCID: 0009-0004-6935-8147
OpenAlex ID: A5110229601
Fracture strength characterization and failure analysis of silicon dies
2003 · J.D Wu, C.Y Huang, et al. · Microelectronics Reliability · 73
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition
2005 · J.D. Wu, P.J. Zheng, et al. · Microelectronics Reliability · 56
High-G drop impact response and failure analysis of a chip packaged printed circuit board
2006 · S.T. Jenq, H.S. Sheu, et al. · International Journal of Impact Engineering · 34
Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
2004 · Tong Hong Wang, Yi-Shao Lai, et al. · Journal of Electronic Packaging · 31
An experimental study of failure and fatigue life of a stacked CSP subjected to cyclic bending
2002 · J.D. Wu, S.H. Ho, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24
Thermal deformations and stresses of flip-chip BGA packages with low- and high-T/sub g/ underfills
2005 · Ming-Yi Tsai, Yi-Chieh Lin, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 20
Board level reliability of PBGA using flex substrate
2001 · S.C Hung, P.J Zheng, et al. · Microelectronics Reliability · 20
Electromigration failures of UBM/bump systems of flip-chip packages
2003 · J.D. Wu, P.J. Zheng, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 19
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition
2003 · J.D. Wu, P.J. Zheng, et al. · IEEE International Reliability Physics Symposium proceedings · 15
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration
2006 · Kuo-Ming Chen, J.D. Wu, et al. · Microelectronics Reliability · 13
The comparison of solder joint reliability between BCC++ and QFN
2002 · S.C. Hung, P.J. Zheng, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
Board level reliability of a stacked CSP subjected to cyclic bending
2002 · J.D Wu, S.H Ho, et al. · Microelectronics Reliability · 12
Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
2005 · Ming-Hwa R. Jen, Lee-Cheng Liu, et al. · Journal of Electronic Packaging · 9
A study of cyclic bending reliability of bare-die-type chip-scale packages
2004 · Yi-Shao Lai, Tong Hong Wang, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 8
Electromigration reliability of SnAg/sub x/Cu/sub y/ flip chip interconnects
2004 · J.D. Wu, C.W. Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Effects of substrate metallization on the degradation of flip chip interconnects under electromigration
2004 · J.D. Wu, C.W. Lee, et al. · IEEE Consumer Communications and Networking Conference · 7
Dynamic analysis of wirebonding process on Cu/low-K wafers
2004 · Chang-Lin Yeh, Yi-Shao Lai, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Prediction of gap in QFP with unattached heat spreader
2005 · Yi-Shao Lai, Yi-Hsien Lin, et al. · IEEE Transactions on Components and Packaging Technologies · 5
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls
2003 · Po-Jen Zheng, J.Z. Lee, et al. · Microelectronics Reliability · 5
Experimental study on seismic performance of low-yield-point steel tubular links
2025 · Jun-Yu Wu, Liang-Dong Zhuang, et al. · Engineering Structures · 4
High-G Drop Impact Response and Failure Analysis of a Chip Packaged Printed Circuit Board
2006 · S.T. Jenq, H.S. Sheu, et al. · Electronic Packaging Technology Conference · 3
Experimental study on mechanical properties of tubular cross section links made of low-yield-point steel
2025 · Liang-Dong Zhuang, Jun-Yu Wu, et al. · Structures · 2
Thermal deformations and stresses of flip chip bga packages with low- and high-T/sub g/ underfills
2005 · M.Y. Tsai, Y.C. Lin, et al. · International Conference on Polymers and Adhesives in Microelectronics and Photonics · 1
2007 Int J Impact Eng High G Drop AuthorCopy
2015 · S.T. Jenq, Haw-Yang Sheu, et al.
High-GDropImpact Response andFailure Analysis ofaChipPackaged Printed Circuit Board
2005 · S. T. Jenql, Chang-Lin Yeh, et al.
Works count: 28
Citation count: 386
H-index: 12
I10-index: 12
Year
Topic
Type