Author

Thorsten Matthias

Observed names: Matthias Thorsten, T. Matthias

Institution: EV Group (Austria)

Observed institution: EV Group (Austria)

OpenAlex ID: A5111798869

Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration

2011 · Eun-Jung Jang, Jae-Won Kim, et al. · Metals and Materials International · 52

Recent progress in thin wafer processing

2013 · Thomas Uhrmann, Thorsten Matthias, et al. · IEEE International D Systems Integration Conference · 19

Silicon-based wafer-level packaging for cost reduction of high brightness LEDs

2011 · Thomas Uhrmann, Thorsten Matthias, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 16

CMOS image sensor wafer-level packaging

2011 · Thorsten Matthias, Gerald Kreindl, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 14

Advanced wafer bonding solutions for TSV integration with thin wafers

2009 · Bioh Kim, Thorsten Matthias, et al. · IEEE International Conference on 3D System Integration (3DIC) · 13

Effect of Post-Annealing Conditions on Cu-Cu Wafer Bonding Characteristics

2009 · Eun-Jung Jang, Young-Bae Park, et al. · Journal of the Korean Physical Society · 8

Comparison of Enabling Wafer Bonding Techniques for TSV Integration

2010 · Bioh Kim, Thorsten Matthias, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 7

Room temperature debonding — An enabling technology for TSV and 3D integration

2012 · Thorsten Matthias, Gunter Pauzenberger, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 6

Aluminum Thermo Compression Bonding Characterization

2009 · Erkan Cakmak, Viorel Dragoi, et al. · MRS Proceedings · 6

Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications

2006 · Viorel Dragoi, Gerald Mittendorfer, et al. · ECS Transactions · 6

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Thin wafer processing - yield enhancement through integrated metrology

2011 · Thorsten Matthias, Daniel Burgstaller, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5

3D Process Integration – Wafer-to-Wafer and Chip-to-Wafer Bonding

2006 · Thorsten Matthias, Markus Wimplinger, et al. · MRS Proceedings · 5

Temporary bonding on the move towards high volume: A status update on cost-of-ownership

2014 · Thomas Uhrmann, Jurgen Burggraf, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 3

Cu-Cu Thermo-Compression Bonding for TSV Integration

2010 · Bioh Kim, Thorsten Matthias, et al. · ECS Transactions · 3

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Aligned Low Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises

2007 · Viorel Dragoi, Thorsten Matthias, et al. · MRS Proceedings · 3

Nanoimprint lithography for microfluidics manufacturing

2013 · Gerald Kreindl, Thorsten Matthias · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2

Wafer Bonding for Backside Illuminated Image Sensors

2012 · Thorsten Matthias, Thomas Uhrmann, et al. · ECS Transactions · 2

Room Temperature Debonding - An Enabling Technology for TSV and 3D Integration

2012 · Thorsten Matthias, Eric Pabo, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2

Advances in spray coating technologies for MEMS, 3DICs and additional applications

2011 · Eric F Pabo, Hirokazu Kurotaki, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2

Enabling Wafer Level Processes for CIS Manufacturing

2010 · Eric F. Pabo, Garrett Oakes, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2

Cu-Cu 열압착 웨이퍼 접합부의 계면접합강도에 미치는 N2+H2 분위기 열처리의 영향

2009 · Eun‐Jung Jang, Jaewon Kim, et al. · Journal of the Microelectronics and Packaging Society · 2

Chip‐to‐Wafer and Wafer‐to‐Wafer Integration Schemes

2008 · Thorsten Matthias, Stefan Pargfrieder, et al. · Wiley eBooks · 2

Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications

2006 · Viorel Dragoi, Gerald Mittendorfer, et al. · ECS Meeting Abstracts · 2

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Unique Polymer Coating Process for Improving Performance and Reliability of 3D Wafer Level Packaging

2014 · Antun Peić, Felix Massa, et al. · Wafer-Level Packaging Symposium · 1

Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield

2014 · Thomas Uhrmann, Jürgen Burggraf, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1

Works count: 69

Citation count: 194

H-index: 7

I10-index: 5