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Author

Stephen Kenny

Institution: Atotech (Germany)
Observed institution: Atotech (Germany)
OpenAlex ID: A5113542555
Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes
2012 · Bernd Roelfs, Nina Dambrowsky, et al. · Circuit World · 35
A comprehensive packaging solution for next generation IC substrates
2011 · Stephen Kenny, Dave Baron, et al. · European Microelectronics and Packaging Conference · 3
“Green” PCB production processes
2008 · Sven Lamprecht, Günter Heinz, et al. · Circuit World · 3
Electrolytic solder deposit for next generation flip chip solder bumping: 2010 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference
2010 · Stephen Kenny, Bernd Roelfs, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
Electrolytic solder deposit for next generation flip chip solder bumping
2010 · Bernd Roelfs, Stephen Kenny, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
Production of Uniform Dimension Copper Pillars for Flip Chip CSP
2013 · Stephen Kenny, Kai Matejat, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Via filling: Challenges for the plating process for conveyorised production
2012 · Stephen Kenny, Nina Dambrowsky, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
High Aspect Ratio Package Core Production with Electrolytic Deposited Copper
2010 · Stephen Kenny, Bernd Roelfs · IMAPSource Proceedings · 1
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From thin cores to outer layers: Filling through holes and blind micro vias with copper by reverse pulse plating
2009 · Stephen Kenny, Bernd Roelfs · International Conference on Electronic Packaging Technology (ICEPT) · 1
Advanced via filling for improved within-unit distribution
2013 · Henning Hubner, Stephen Kenny, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Thin Palladium Layers as an Effective Cost Saving Strategy in Electronics Applications
2012 · Olaf Kurtz, Jürgen Barthelmes, et al. · Pan Pacific Symposium
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip Chip Packaging
2012 · Stephen Kenny, Kai Matejat, et al. · IMAPSource Proceedings
New Challenges For Higher Aspect Ratio: Filling Through Holes And Blind Micro Vias With Copper By Reverse Pulse Plating
2011 · Bernd Roelfs, Nina Dambrowsky, et al. · SMTA International
Electrolytic Solder Deposit for Next Generation Flip Chip Solder Bumping
2010 · Stephen Kenny, Sven Lamprecht, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
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Horizontal systems: Leading technology for next generation HDI production
2009 · Stephen Kenny, Tafadzwa Magaya · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Copper Electroplating Process for Next Generation Core Through-Via Filling
2009 · Stephen Kenny, Bernd Roelfs · Pan Pacific Symposium
Horizontal Reel to Reel Copper Plating with InPulse 2
2008 · Stephen Kenny, Demitry Kostouros · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Works count: 17
Citation count: 49
H-index: 3
I10-index: 1
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