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Klaus K. Schuegraf

Handbook of thin-film deposition processes and techniques : principles, methods, equipment, and applications
1988 · K. Schuegraf · Noyes Publications eBooks · 149
Semiconductor Logic Technology Innovation to Achieve Sub-10 nm Manufacturing
2013 · Klaus Schuegraf, Mathew C. Abraham, et al. · IEEE Journal of the Electron Devices Society · 102
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Ultra high speed SiGe NPN for advanced BiCMOS technology
2002 · M. Racanelli, K. Schuegraf, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 75
A 5.6MB/s 64Gb 4b/Cell NAND Flash memory in 43nm CMOS
2009 · C. Trinh, N. Shibata, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 71
Transistor wars
2011 · Khaled Ahmed, Klaus Schuegraf · IEEE Spectrum · 62
Deposition Technologies and Applications
2001 · Werner Kern, Klaus K. Schuegraf · Elsevier eBooks · 44
Is strain engineering scalable in FinFET era?: Teaching the old dog some new tricks
2012 · Aneesh Nainani, Shashank Gupta, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 37
Memory grows up
2010 · Agostino Pirovano, Klaus Schuegraf · Nature Nanotechnology · 32
$RC$ Performance Evaluation of Interconnect Architecture Options Beyond the 10-nm Logic Node
2014 · Serkan Kincal, Mathew C. Abraham, et al. · IEEE Transactions on Electron Devices · 21
BC35: a 0.35 μm, 30 GHz production RF BiCMOS technology
2003 · M. Racanelli, Zhe Zhang, et al. · IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) · 17
0.18 μm SiGe BiCMOS technology for wireless and 40 Gb/s communication products
2002 · K. Schuegraf, M. Racanelli, et al. · IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) · 16
Epitaxially Defined FinFET: Variability Resistant and High-Performance Technology
2014 · Sushant Mittal, Shashank Gupta, et al. · IEEE Transactions on Electron Devices · 13
Oxide-isolated integrated injection logic
1974 · R. Allen, K. Schuegraf · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 9
Hermetically sealed silicon chip diodes and transistors
1962 · J.L. Langdon, W.E. Mutter, et al. · IRE Transactions on Electron Devices · 8
Semiconductor Manufacturing
2013 · Rajendra Singh, Luigi Colombo, et al. · Wiley eBooks · 7
Design Approach to Radiation-Hardened I2L Gate Arrays
1978 · Ali Bahraman, Stephen Chang, et al. · IEEE Transactions on Nuclear Science · 7
Epi defined (ED) FinFET: An alternate device architecture for high mobility Ge channel integration in PMOSFET
2013 · S. Mittal, S. Gupta, et al. · IEEE International Nanoelectronics Conference · 6
Radiation-Hardened Performance-Optimized I2L LSI
1977 · A. Bahraman, S. Chang, et al. · IEEE Transactions on Nuclear Science · 6
Epitaxialy defined (ED) FinFET: to reduce VT variability and enable multiple VT
2012 · S. Mittal, S. Gupta, et al. · Conference digest · 5
Schottky-base I/sup 2/L: a high-performance LSI technology
1979 · A. Bahraman, S.Y.S. Chang, et al. · IEEE Journal of Solid-State Circuits · 5
Hochreines Germanium – Oberflächenleitung und Trägerlebensdauer
1963 · F. Aurich, H. P. Kleinknecht, et al. · Annalen der Physik · 5
Radiation Effects on Bipolar Integrated Injection Logic
1975 · J. P. Raymond, T. Y. Wong, et al. · IEEE Transactions on Nuclear Science · 4
Photomask challenges for data-centric computing in the 2020s
2021 · Klaus Schuegraf · Photomask and next-generation lithography mask technology. Conference · 1
Textured AZO on silicon oxy-nitride barrier films for enhanced light trapping in micromorph tandem junction solar cells
2010 · Yashraj Bhatnagar, Brendan McComb, et al. · Conference record of the IEEE Photovoltaic Specialists Conference · 1
Single-wafer process technology: enabling rapid SiGe BiCMOS development
2003 · K. Schuegraf · IEEE Transactions on Semiconductor Manufacturing · 1
Works count: 36
Citation count: 706
H-index: 12
I10-index: 12
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