Work

Silicon-On-Diamond layer integration by wafer bonding technology

Year: 2010

Type: article

Source: Diamond and Related Materials

DOI: 10.1016/j.diamond.2010.01.049

Authors: M. Rabarot, J. Widiez, S. Saada, J.-P. Mazellier, C. Lecouvey, J.-C. Roussin, J. Dechamp, P. Bergonzo, F. Andrieu, O. Faynot, S. Deleonibus, L. Clavelier, J.P. Roger

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, Laboratoire d'Intégration des Systèmes et des Technologies, Centre National de la Recherche Scientifique, ParisTech, Institut Langevin, ESPCI Paris

Language: English

Topic: Diamond and Carbon-based Materials Research

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: Agence Nationale de la Recherche

OpenAlex ID: W1983994459

FWCI: 1.399

Cites: 22

Cited by: 38

Related to: 10