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Dave Hetzer
Observed names:
Dave R. Hetzer,
Hetzer, Dave
Institution:
Tokyo Electron (Japan)
Observed institution:
Tokyo Electron (Japan)
ORCID:
0009-0008-0233-9776
Observed ORCID:
0009-0008-0233-9776
OpenAlex ID:
A5007488602
EUV patterning successes and frontiers
2016
·
Nelson Felix
, Dan Corliss
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
28
Outlook for high-NA EUV patterning: a holistic patterning approach to address upcoming challenges
2022
·
Angélique Raley
, Lior Huli
, et al.
·
Advanced Etch Technology and Process Integration for Nanopatterning
·
18
Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
2020
·
Ashim Dutta
, Jennifer Church
, et al.
·
SPIE Conference on Extreme Ultraviolet (EUV) Lithography
·
13
Defect detection strategies and process partitioning for single-expose EUV patterning
2018
·
Luciana Meli
, Karen Petrillo
, et al.
·
Journal of Micro/Nanopatterning Materials and Metrology
·
13
Driving down defect density in composite EUV patterning film stacks
2017
·
Luciana Meli
, Karen Petrillo
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
13
Utilization of spin-on and reactive ion etch critical dimension shrink with double patterning for 32 nm and beyond contact level interconnects
2009
·
Karen Petrillo
, Dave Horak
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
9
Effect and procedures of post-exposure bake temperature optimization on the CD uniformity in a mass production environment
2007
·
Kirsten Ruck
, Heiko Weichert
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
8
High speed EUV using post processing and self-aligned double patterning as a speed enhancement technique
2014
·
Jerome Wandell
, Anton deVilliers
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
5
Superlattice effects and limitations of non-destructive measurement of advanced Si/Si1−xGex superlattice structures using Mueller matrix scatterometry and high-resolution X-ray diffraction
2024
·
Ezra Pasikatan
, George A. Antonelli
, et al.
·
Journal of Micro/Nanopatterning Materials and Metrology
·
4
Defectivity issues in topcoat-free photoresists
2009
·
Karen Petrillo
, Rick Johnson
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
4
The defect mitigation on EUV stack by track based technology
2019
·
Naoki Shibata
, Lior Huli
, et al.
·
Extreme Ultraviolet (EUV) Lithography
·
3
Defect detection strategies and process partitioning for SE EUV patterning (Conference Presentation)
2018
·
Shinichiro Kawakami
, Luciana Meli
, et al.
·
Extreme Ultraviolet (EUV) Lithography
·
3
Assessment of negative tone development challenges
2012
·
Sohan S. Mehta
, Yongan Xu
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
3
Material and process improvements towards sub 36nm pitch EUV single exposure
2019
·
Karen Petrillo
, Cody Murray
, et al.
·
2
Qualification of an integrated scatterometer for CD measurements of sub-100nm resist structures in a high-volume 300mm DRAM production environment
2005
·
Thomas Marschner
, Goeran Fleischer
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
2
Non-destructive lateral cavity etch measurements of 8-superlattice layer nanowire test structures using optical Mueller matrix spectroscopic ellipsometry, x-ray diffraction, and x-ray fluorescence
2025
·
Ezra Pasikatan
, G. Andrew Antonelli
, et al.
·
Journal of Applied Physics
·
1
Optimization of spin-on metal oxide resist performance via new development techniques on sub-30nm pitch patterning
2023
·
Lior Huli
, Kanzo Kato
, et al.
·
Advances in Patterning Materials and Processes
·
1
Track based techniques to improve high-resolution EUV patterning defectivity
2018
·
Eric Liu
, Naoki Shibata
, et al.
·
International Conference on Extreme Ultraviolet Lithography
·
1
CD and profile metrology of embedded phase shift masks using scatterometry
2006
·
Kyung man Lee
, Sanjay Yedur
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
1
90-nm lithography process characterization using ODP scatterometry technology
2004
·
Chih-Ming Ke
, Shinn-Sheng Yu
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
1
Application of scatterometry for CD and profile metrology in 193-nm lithography process development
2003
·
Li-Jui Chen
, Chih-Ming Ke
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
1
Deeply Penetrating Multi-Modality Imaging for 3DI Overlay Non-Destructive Measurements
2024
·
Shuyan Zhang
, Seung Ryong Bae
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Investigation of Spin-on Films as Mold Stack and Controlling Wafer Warpage for 3D Memory Integration
2023
·
Soodoo Chae
, Hojin Kim
, et al.
·
International Conference on Solid State Devices and Materials (SSDM)
Coater/developer based techniques to achieve sub-30nm CAR process on EUV stack
2022
·
Kanzo Kato
, Lior Huli
, et al.
·
Advances in Patterning Materials and Processes
Coater/developer and new underlayer application to sub-30nm process
2021
·
Kanzo Kato
, Naoki Shibata
, et al.
·
International Conference on Extreme Ultraviolet Lithography
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Works count:
32
Citation count:
134
H-index:
7
I10-index:
5
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