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Maria Durham
Observed name:
Durham Maria
Observed institution:
Indium Corporation (United States)
OpenAlex ID:
A5011924526
Flux challenges in flip-chip die-attach
2015
·
SzePei Lim
, Jason Chou
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
12
Ultralow residue (ULR) semiconductor grade fluxes for copper pillar flip-chip
2014
·
SzePei Lim
, Jason Chou
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
4
Test method to evaluate a robust ball grid array (BGA) ball mount flux
2016
·
Sheng-Hung Chou
, Yan Liu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
No clean material for advance packaging assembly
2016
·
SzePei Lim
, Maria Durham
, et al.
·
China Semiconductor Technology International Conference (CSTIC)
·
1
Emerging Flux Challenges for BGA Packages
2016
·
Maria Durham
, Andy Mackie
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
·
1
PDF
Sip Package Defect Case Study -- Tombstone and HIP
2017
·
Sheng-Hung Chou
, Jonas Sigfrid Sjoberg
, et al.
·
Regional Events
Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNs
2016
·
Brandon Judd
, Maria Durham
·
IMAPSource Proceedings
ロバストなボールグリッドアレイ(BGA)ボール実装フラックスを評価するための試験方法【Powered by NICT】
2016
·
Sheng-Hung Chou
, Yan Liu
, et al.
·
IEEE Conference Proceedings
The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process
2015
·
Brandon Judd
, Maria Durham
·
IMAPSource Proceedings
Ultralow Residue (ULR) Semiconductor Grade Fluxes for Copper Pillar Flip-Chip
2015
·
SzePei Lim
, Jason Chou
, et al.
·
Regional Events
Ultralow Residue (ULR) Semiconductor Grade Fluxes for Flip-Chip and MEMs Applications
2015
·
Maria Durham
, SzePei Lim
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
PDF
Solderability Challenges in Emerging BGA Packages
2014
·
Maria Durham
, Yan Liu
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Semiconductor Fluxes for Wafer Bumping in 3D Assembly
2013
·
Maria Durham
, Laura Mauer
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
PDF
Solder Paste Dipping With 0.4mm Pitch PoP Packages
2012
·
Christopher Nash
, Maria Durham
·
Soldering and Reliability Conferences
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Works count:
14
Citation count:
21
H-index:
3
I10-index:
1
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