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Author

Thomas Krivec

Observed name: T. Krivec
ORCID: 0009-0006-8698-3416
Observed ORCID: 0009-0006-8698-3416
OpenAlex ID: A5036487496
Examination of the suitability of α-tocopherol as a stabilizer for ultra-high molecular weight polyethylene used for articulating surfaces in joint endoprostheses
2002 · C. Wolf, T. Krivec, et al. · Journal of Materials Science Materials in Medicine · 81
Advanced 3D failure characterization in multi-layered PCBs
2016 · E. Grünwald, R. Hammer, et al. · NDT & E International · 23
Model free kinetics coupled with finite element method for curing simulation of thermosetting epoxy resins
2018 · Qi Tao, Gerald Pinter, et al. · Journal of Applied Polymer Science · 21
Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
2017 · Qi Tao, Gerald Pinter, et al. · Microelectronics Reliability · 12
Package Level Warpage Simulation of a Fan Out System in Board Module
2019 · M. Frewein, T. Krivec, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 11
Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment
2019 · Karsten Schischke, Dionysios Manessis, et al. · European Microelectronics and Packaging Conference · 10
Finite element analysis of arbitrarily complex electronic devices
2016 · Mario Gschwandl, Peter Fuchs, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 10
Method development for the cyclic characterization of thin copper layers for PCB applications
2014 · K. Fellner, P.F. Fuchs, et al. · Circuit World · 10
Fatigue life assessment of metal foils in multifunctional composites via combined experiments and simulations
2023 · Claus O.W. Trost, Stanislav Žák, et al. · Composites Part B Engineering · 9
Panel Level Warpage Simulation of Printed Circuit Boards comprising electrical components
2020 · J. Zundel, T. Krivec, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 9
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
2014 · Katerina Macurova, Paul Angerer, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 9
An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage
2022 · M. Frewein, S. Stojanovic, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 8
Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly Process
2015 · K. Macurova, R. Bermejo, et al. · Journal of Microelectronics and Electronic Packaging · 8
Inverse Parameter Determination for Metal Foils in Multifunctional Composites
2022 · Claus O.W. Trost, Martin Krobath, et al. · Materials & Design · 7
Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach
2023 · M. Weninger, J. Zündel, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 6
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
2019 · Mario Gschwandl, Peter Filipp Fuchs, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
2017 · D. Manessis, J. Pawlikowski, et al. · European Microelectronics and Packaging Conference · 6
Femtosecond laser drilling of epoxy composites: a review of mechanisms, modeling, and adaptive control
2025 · Chongnan Peng, Johannes Macher, et al. · The International Journal of Advanced Manufacturing Technology · 5
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Application of machine learning modeling for predicting the reliability of solder joints under thermal cycling
2025 · Qiulin Yu, Chinmay Nawghane, et al. · Microelectronics Reliability · 5
Characterization of prepreg shrinkage and investigation of its influence on warpage simulation
2021 · J. Zundel, M. Sagerer, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5
Stress and Deflection Development During Die Embedding into Printed Circuit Boards
2015 · K. Macurova, P. Angerer, et al. · Materials Today Proceedings · 5
Multi-physics simulation of the component attachment within embedding process
2013 · K. Macurova, A. Kharicha, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5
Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices
2019 · D. Manessis, K. Schischke, et al. · European Microelectronics and Packaging Conference · 4
Literature Review: Global Criticality Assessment Based on Feature Surrogates at the PCBA Levels
2024 · Qiulin Yu, Vikram G. Kamble, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Single‐Step Kinetic Predictions Based on a Constructed Isoconversional State Diagram
2023 · Qi Tao, Thomas Krivec, et al. · Macromolecular Theory and Simulations · 3
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Works count: 47
Citation count: 301
H-index: 9
I10-index: 8
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