Author

Shohei Shima

Observed name: Shohei SHIMA

Institution: Ebara (Japan)

Observed institutions: Toshiba (Japan), Ebara (Japan)

OpenAlex ID: A5112293268

Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process

2016 · Byoung-Jun Cho, Shohei Shima, et al. · Applied Surface Science · 95

Visualizing Nanoscale Distribution of Corrosion Cells by Open-Loop Electric Potential Microscopy

2016 · Kyoko Honbo, Shoichiro Ogata, et al. · ACS Nano · 44

Effects of Liner Metal and CMP Slurry Oxidizer on Copper Galvanic Corrosion

2007 · Shohei Shima, Akira Fukunaga, et al. · ECS Transactions · 29

Nanoscale corrosion behavior of polycrystalline copper fine wires in dilute NaCl solution investigated by in-situ atomic force microscopy

2016 · Shoichiro Ogata, Naritaka Kobayashi, et al. · Corrosion Science · 22

Stress Corrosion Cracking of Cu Interconnects during CMP with a Cu/Porous Low-k Structure

2005 · Masako Kodera, Shin-ichiro Uekusa, et al. · Journal of The Electrochemical Society · 17

Crystalline Structure Changes of Molybdenum Silicide Films Deposited by Sputtering and by Coevaporation after Isochronal Annealing

1982 · Kenji Shibata, Shohei Shima, et al. · Journal of The Electrochemical Society · 13

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Localized Oxidation of the Cu Surface after Chemical Mechanical Planarization Processing

2005 · Masako Kodera, Yukiko Nishioka, et al. · Japanese Journal of Applied Physics · 12

Effect of pH and chemical mechanical planarization process conditions on the copper–benzotriazole complex formation

2016 · Byoung-Jun Cho, Jin-Yong Kim, et al. · Japanese Journal of Applied Physics · 11

Barrier Effects of Tungsten Infer-Layer for Aluminum Diffusion in Aluminum/Silicon Ohmic-Contact System

1985 · Tohru Hara, Shuichi Enomoto, et al. · Japanese Journal of Applied Physics · 11

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In situ ellipsometry of Cu surfaces immersed in benzotriazole–hydrogen peroxide solutions

2016 · Eiichi Kondoh, Tatsuya Kawakami, et al. · Japanese Journal of Applied Physics · 8

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Structures of Cu surfaces developing in benzotriazole solutions: Effect of pH

2017 · Eiichi Kondoh, Tatsuya Kawakami, et al. · Japanese Journal of Applied Physics · 6

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Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations

2011 · Shohei Shima, Yutaka Wada, et al. · Japanese Journal of Applied Physics · 5

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Flat-shaped microfluidic optical cell for in situ ellipsometry using glass slide as optical window component

2018 · Eiichi Kondoh, Koki Segawa, et al. · Japanese Journal of Applied Physics · 3

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Metrologies of abrasive behaviors for understanding and upgrading CMP process

2016 · Shohei Shima, Satomi Hamada, et al. · IEEE International Symposium on Semiconductor Manufacturing conference proceedings · 3

Growth kinetics of Cu surface layers in H 2 O 2 –BTA aqueous solutions

2020 · Eiichi Kondoh, Mao Toyama, et al. · Japanese Journal of Applied Physics · 2

Analysis on Copper Photocorrosion Induced by Illuminance in Chemical Mechanical Planarization Equipment Using Photodiode and Quartz Crystal Microbalance

2010 · Shohei Shima, Yutaka Wada, et al. · Japanese Journal of Applied Physics · 2

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Surface potential change with droplet formation and Cu watermark growth by electrochemical oxidation resulting therefrom

2014 · Shohei Shima, Satomi Hamada, et al. · International Conference on Planarization/CMP Technology (ICPT) · 1

Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning

2014 · Byoung Jun Cho, Jin Goo Park, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 1

Detection of nano particles attached on thin films

2020 · Eiichi KONDOH, Atsushi TAKAHASHI, et al. · The Proceedings of Conference of Kanto Branch

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Droplet Evaporation and Watermark Formation on Si Wafers with Various Films

2020 · Ayako YANO, Kenji AMAGAI, et al. · Journal of the Japan Society for Precision Engineering

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Characterization of Self-Contamination from PVA Roll Brush with Atomic Force Microscopy and Fluorescent Microscopy

2018 · Shohei Shima, Satomi Hamada, et al. · IEEE International Symposium on Semiconductor Manufacturing conference proceedings

化学機械研磨プロセス開発における「その場」観察の適用事例

2016 · 昇平嶋, 聡美濵田, et al.

OS0117 In-situ ellipsometry of Cu surfaces immersed in BTA-H_2O_2 solutions

2016 · Tatsuya KAWAKAMI, Eiichi KONDOH, et al. · The Proceedings of Conference of Kanto Branch

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OS0116 Electrode Potential Measurement of Cu under Laminar Pure Water Flow in a Microfluidic Channel

2016 · Moriaki OBA, Tadashi OBO, et al. · The Proceedings of Conference of Kanto Branch

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OS0110 Ellipsometoric measurement of paticle-spiked wafer surfaces

2016 · Katsuya SUZUKI, Hayato KOTAGIRI, et al. · The Proceedings of Conference of Kanto Branch

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Works count: 40

Citation count: 285

H-index: 9

I10-index: 9