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M. Sakao
Observed name:
M Sakao
Observed institutions:
NEC (Japan),
Mitsubishi Electric (Japan)
OpenAlex ID:
A5022201765
A 30-ns 64-Mb DRAM with built-in self-test and self-repair function
1992
·
A. Tanabe
, T. Takeshima
, et al.
·
IEEE Journal of Solid-State Circuits
·
81
A capacitor-over-bit-line (COB) cell with a hemispherical-grain storage node for 64 Mb DRAMs
2002
·
M. Sakao
, N. Kasai
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
42
A high-density data-path generator with stretchable cells
1994
·
Y. Tsujihashi
, H. Matsumoto
, et al.
·
IEEE Journal of Solid-State Circuits
·
14
A 250-Mb/s/pin, 1-Gb double-data-rate SDRAM with a bidirectional delay and an interbank shared redundancy scheme
2000
·
Y. Takai
, M. Fujita
, et al.
·
IEEE Journal of Solid-State Circuits
·
12
A 30 ns 64 Mb DRAM with built-in self-test and repair function
2003
·
H. Koike
, A. Tanabe
, et al.
·
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
·
10
Device Technology for embedded DRAM utilizing stacked MIM(Metal-Insulator-Metal) Capacitor
2006
·
Y. Yamagata
, H. Shirai
, et al.
·
Custom Integrated Circuits Conference
·
6
A 250 Mb/s 1 Gb double data rate SDRAM with a bi-directional delay and an inter-bank shared redundancy scheme
2003
·
Y. Takai
, M. Fujita
, et al.
·
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
·
6
A new DRAM cell with a transistor on a lateral epitaxial silicon layer (TOLE cell)
1990
·
K. Terada
, T. Ishijima
, et al.
·
IEEE Transactions on Electron Devices
·
6
A new soft-error immune DRAM cell with a transistor on a lateral epitaxial silicon layer (TOLE cell)
1987
·
T. Kubota
, T. Ishijima
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
6
Low-temperature integrated process below 500°C for thin Ta/sub 2/O/sub 5/ capacitor for giga-bit DRAMs
2002
·
Y. Takaishi
, M. Sakao
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
4
Ultra-high-performance 0.13-μm embedded DRAM technology using TiN/HfO/sub 2//TiN/W capacitor and body-slightly-tied SOI
2003
·
Y. Aoki
, T. Ueda
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
3
A 0.15 μm logic based embedded DRAM technology featuring 0.425 μm/sup 2/ stacked cell using MIM (metal-insulator-metal) capacitor
2002
·
M. Takeuchi
, K. Inoue
, et al.
·
Symposium on VLSI Technology
·
3
A high-performance 0.18-μm merged DRAM/Logic technology featuring 0.45-μm/sup 2/ stacked capacitor cell
2003
·
M. Hamada
, K. Inoue
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
2
A New CMOS Structure Using a Transistor on a Lateral Epitaxial Silicon Layer
1988
·
T. Ishijima
, K. Terada
, et al.
·
International Conference on Solid State Devices and Materials (SSDM)
·
2
Overview and Future Challenges eDRAM Technologies
2007
·
H. sugimura
, T. Wake
, et al.
·
International Conference on Solid State Devices and Materials (SSDM)
·
1
A CMOS/partial-SOI structure for future ULSIs
2003
·
K. Terada
, T. Ishijima
, et al.
·
IEEE SOS/SOI Technology Conference
·
1
A Capacitor over Bit-Line (COB) Stacked Capacitor Cell Using Local Interconnect Layer for 64 MbDRAMs
1993
·
N. Kasai
, M. Sakao
, et al.
·
IEICE Transactions on Electronics
·
1
A 1.71-million transistor CMOS CPU chip with a testable cache architecture
1993
·
Y. Saito
, Y. Shimazu
, et al.
·
IEEE Journal of Solid-State Circuits
·
1
Embedded DRAM Technology for Consumer Electronics
2008
·
H. Shirai
, Ryousuke Ishikawa
, et al.
·
IEICE Technical Report; IEICE Tech. Rep.
Device Technology for embedded DRAM utilizing stacked MIM(Metal-Insulator-Metal) Capacitor
2007
·
Tanigawa Takaho
, Yasushi Yamagata
, et al.
·
IEICE Technical Report; IEICE Tech. Rep.
A 0.13 μm full metal embedded DRAM technology targeting on 1.2 V, 450 MHz operation
2002
·
S. Arai
, T. Sakoh
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
Logic based Embedded DRAM technologies targeting Low Voltage and High Speed Operation
2002
·
Susumu Arai
, T. Sakoh
, et al.
·
半導体・集積回路技術シンポジウム講演論文集
A VLSI chip set for a large-scale parallel inference machine: PIM/m
1993
·
H. Machida
, H. Ando
, et al.
·
IEEE Journal of Solid-State Circuits
64Mb・DRAM用の半球状の結晶粒記憶節点を持つビットライン上のコンデンサ(COB)セル
1990
·
M Sakao
, N Kasai
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
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Works count:
24
Citation count:
201
H-index:
6
I10-index:
5
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