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P. L. Smith

Observed names: P. L. SMITH, P. Smith, P.L. Smith, Patrick L. Smith, Patrick Smith, Smith, P.
OpenAlex ID: A5103408552
Formation of epitaxial CoSi2 films on (001) silicon using Ti-Co alloy and bimetal source materials
1991 · S. L. Hsia, T. Y. Tan, et al. · Journal of Applied Physics · 118
Resistance and structural stabilities of epitaxial CoSi2 films on (001) Si substrates
1992 · S. L. Hsia, T. Y. Tan, et al. · Journal of Applied Physics · 107
Defect annihilation in shallow p+ junctions using titanium silicide
1987 · D. S. Wen, P. L. Smith, et al. · Applied Physics Letters · 104
Incorporation of metal silicides and refractory metals in VLSI technology
1991 · C.M. Osburn, Q.F. Wang, et al. · Applied Surface Science · 66
Ultra Shallow Junction Formation Using Diffusion from Silicides: I . Silicide Formation, Dopant Implantation and Depth Profiling
1992 · H. Jiang, C. M. Osburn, et al. · Journal of The Electrochemical Society · 51
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Thermal Stability of Thin Submicrometer Lines of CoSi2
1993 · Q. F. Wang, C. M. Osburn, et al. · Journal of The Electrochemical Society · 42
Stability of interfacial oxide layers during silicon wafer bonding
1989 · K.-Y. Ahn, R. Stengl, et al. · Journal of Applied Physics · 39
Growth, shrinkage, and stability of interfacial oxide layers between directly bonded silicon wafers
1990 · K.-Y. Ahn, R. Stengl, et al. · Applied Physics A · 38
Elimination of End‐of‐Range Shallow Junction Implantation Damage during CMOS Titanium Silicidation
1989 · D. ‐S. Wen, P. Smith, et al. · Journal of The Electrochemical Society · 37
Effects of polymer/metal interaction in thin-film multichip module applications
2002 · G.M. Adema, I. Turlik, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18
Studies of the Possible Reaction of WF 6 with SiO2 and Si3 N 4 at Several Temperatures
1992 · A. Kepten, A. Reisman, et al. · Journal of The Electrochemical Society · 14
Use of scanning tunneling microscopy and transmission electron microscopy to quantify and characterize CoSi2 roughness
1992 · R. C. Chapman, P. Smith, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 13
Silicon Consumption During Self-Aligned Titanium Suicide Formation on Shallow Junctions
1989 · P.L. Smith, C.M. Osburn, et al. · MRS Proceedings · 10
On the Thermal Etching of Silicon
1988 · A. Reisman, S. T. Edwards, et al. · Journal of The Electrochemical Society · 10
Laser processing of TiSi2 and CoSi2 thin films on silicon (100) substrates
1991 · P. Tiwari, Mary Longo, et al. · Journal of Electronic Materials · 9
Diffusion phenomena due to ion implantation damage and arsenic and phosphorus codiffusion
1990 · R. Deaton, U. Gösele, et al. · Journal of Applied Physics · 9
Further Comments on the Thermal Etching of Silicon: The Surface Morphology of (100), (111) and (110) Wafers in the Temperature Range 900°–1150°C
1990 · A. Reisman, D. Temple, et al. · Journal of The Electrochemical Society · 6
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Pulsed Laser And Ion Beam Surface Modification of Sintered, Alpha-Sic
1985 · K. L. More, R. F. Davis, et al. · MRS Proceedings · 5
Analysis and implications of residual metal on spacer material in the self-align silicide process for VSLI manufacturing
2002 · P.L. Smith, T. Hossain, et al. · IEEE International Symposium on Semiconductor Manufacturing conference proceedings · 4
Pseudo-C11b Phase Formation of Titanium Disilicide During the C49 to C54 Transition
1997 · Patrick L. Smith, Richard Ortega, et al. · MRS Proceedings · 4
High resistivity Co and Ti silicide formation on silicon-on-insulator substrates
1994 · S.L. Hsia, G.E. McGuire, et al. · Thin Solid Films · 4
Materials and device issues in the formation of sub-100-nm junctions
1993 · C.M. Osburn, S. Chevacharoenkul, et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 4
CoSi and CoSi2 Phase Formation on Bulk and Soi Si Substrates
1993 · S. L. Hsia, T. Y. Tan, et al. · MRS Proceedings · 3
Effects of ‘As Deposited’ and Alloying Temperatures on the Distribution of Cu in 0.5%Cu-Al Films
1999 · P. L. Smith, J. Gazda · MRS Proceedings · 2
Novel surface imaging masking technique for high-aspect-ratio dry etching applications
1991 · Gary S. Calabrese, Livingstone N. Abali, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Works count: 40
Citation count: 726
H-index: 12
I10-index: 14
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