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Roy Koret

Observed name: R. Koret
OpenAlex ID: A5061204269
First Monolithic Integration of 3D Complementary FET (CFET) on 300mm Wafers
2020 · S. Subramanian, M. Hosseini, et al. · Symposium on VLSI Technology · 141
Metrology of thin resist for high NA EUVL
2022 · Gian F. Lorusso, Christophe Beral, et al. · Metrology, Inspection, and Process Control XXXVI · 22
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement
2022 · Daniel Schmidt, Aron Cepler, et al. · IEEE Transactions on Semiconductor Manufacturing · 22
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Hybrid metrology solution for 1X node technology
2012 · Alok Vaid, Alexander Elia, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 20
OCD enhanced: implementation and validation of spectral interferometry for nanosheet inner spacer indentation
2021 · Daniel Schmidt, Curtis Durfee, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 17
Machine learning for predictive electrical performance using OCD
2019 · Sayantan Das, Joey Hung, et al. · Metrology, Inspection, and Process Control XXXVI · 11
Hybrid metrology universal engine: co-optimization
2014 · Alok Vaid, Carmen Osorio, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8
300 mm-wafer metrology for area-selective deposition in nanoscale patterns: A case study for ruthenium atomic layer deposition
2023 · J.J. Clerix, L. Warad, et al. · Applied Surface Science · 7
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Spectral interferometry for fully integrated device metrology
2023 · Daniel Schmidt, Manasa Medikonda, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 7
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Vertical travelling scatterometry for metrology on fully integrated devices
2022 · Daniel Schmidt, Manasa Medikonda, et al. · Metrology, Inspection, and Process Control XXXVI · 7
Advanced EUV Resist Characterization using Scatterometry and Machine Learning
2021 · Daniel Schmidt, Karen Petrillo, et al. · ASMC proceedings · 7
Measuring local CD uniformity in EUV vias with scatterometry and machine learning
2020 · Dexin Kong, Daniel Schmidt, et al. · Metrology, Inspection, and Process Control XXXVI · 7
Application of scatterometry-based machine learning to control multiple electron beam lithography: AM: Advanced metrology
2018 · Nivea Figueiro, Francisco Sanchez, et al. · ASMC proceedings · 7
Spectroscopy: a new route towards critical-dimension metrology of the cavity etch of nanosheet transistors
2021 · Janusz Bogdanowicz, Yusuke Oniki, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 6
Scatterometry and AFM measurement combination for area selective deposition process characterization
2019 · Mohamed Saib, Alain Moussa, et al. · Metrology, Inspection, and Process Control XXXVI · 5
Materials characterization for process integration of multi-channel gate all around (GAA) devices
2017 · Gangadhara Raja Muthinti, Nicolas Loubet, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
300mm in-line metrologies for the characterization of ultra-thin layer of 2D materials
2023 · Alain Moussa, Janusz Bogdanowicz, et al. · Metrology, Inspection, and Process Control XXXVI · 4
Ruthenium direct etch scatterometry solution for self-aligning semi-damascene
2020 · Sara Paolillo, Alain Moussa, et al. · Metrology, Inspection, and Process Control XXXVI · 4
Scatterometry control for multiple electron beam lithography
2017 · Yoann Blancquaert, Nivea Figueiro, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Hybrid metrology co-optimization of critical dimension scanning electron microscope and optical critical dimension
2014 · Alok Vaid, Carmen Osorio, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 4
Development of SiGe Indentation Process Control to Enable Stacked Nanosheet FET Technology
2020 · Dexin Kong, Daniel Schmidt, et al. · ASMC proceedings · 3
Plasma halogenated a-C:H as growth inhibiting layer for ASD of titanium oxide
2020 · Mikhail Krishtab, Joey Hung, et al. · Metrology, Inspection, and Process Control XXXVI · 3
Scatterometry solutions for 14nm half-pitch BEOL layers patterned by EUV single exposure
2021 · Sayantan Das, Joey Hung, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 2
Wafer-scale characterization for two-dimensional material layers
2024 · A. Moussa, J. Bogdanowicz, et al. · Japanese Journal of Applied Physics · 1
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Scatterometry-based methodologies for characterization of MRAM technology
2022 · Manasa Medikonda, Daniel Schmidt, et al. · Metrology, Inspection, and Process Control XXXVI · 1
Works count: 31
Citation count: 328
H-index: 7
I10-index: 6
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