Author

H.W. Dinges

Observed names: H. Dinges, H. W. DINGES, H. W. Dinges
Institution: Deutsche Bundespost
Observed institution: Deutsche Bundespost
OpenAlex ID: A5073695309
1982 · H. Burkhard, H. W. Dinges, et al. · Journal of Applied Physics · 184
1992 · H.W. Dinges, H. Burkhard, et al. · Applied Surface Science · 56
1979 · E. Kuphal, H. W. Dinges · Journal of Applied Physics · 35
1986 · H. Burkhard, E. Kuphal, et al. · Electronics Letters · 19
1993 · J. Vanhellemont, H.E. Maes, et al. · Applied Surface Science · 15
1978 · H.W. Dinges · Thin Solid Films · 10
1991 · H.W. Dinges, B. Kempf, et al. · Applied Surface Science · 6
1990 · H. W. Dinges, B. Kempf, et al. · Surface and Interface Analysis · 4
1994 · B.E. Kempf, H.W. Dinges, et al. · MRS Proceedings · 3
1990 · B. KEMPF, R. GOBEL, et al. · International Conference on Solid State Devices and Materials (SSDM) · 3
2002 · H.W. Dinges, H. Burkhard, et al. · Conference proceedings. ... International Conference on Indium Phosphide and Related Materials
1995 · B. Kempf, H. W. Dinges · International Conference on Solid State Devices and Materials (SSDM)
1994 · B. Kempf, H. W. Dinges, et al. · International Conference on Solid State Devices and Materials (SSDM)
1993 · J. Vanhellemont, H.E. Maes, et al. · Elsevier eBooks
Works count: 24
Citation count: 381
H-index: 8
I10-index: 7
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