Work

High-Performance Cu-Interconnects with Novel Seamless Low-k SiOCH Stacks (SEALS) Featured by Compositional Modulation Process for 45nm-Node ULSI Devices

Year: 2006

Type: conference-paper

Source: Symposium on VLSI Technology

DOI: 10.1109/vlsit.2006.1705240

Institution: NEC (Japan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1532022296

FWCI: 5.085

Cites:

Cited by: 7

Related to: 10